The AVP is designed to efficiently run Teledyne FLIR Prism AI software providing detection, classification, and target tracking and Prism ISP algorithms including super resolution, image fusion, atmospheric turbulence removal, electronic stabilization, local-contrast enhancement, and noise reduction. Prism software runs efficiently on the AVP leveraging the available system on module (SoM) functions to provide critical edge AI capabilities for automotive, airborne, unmanned, counter-UAS (CUAS), perimeter security, and intelligence, surveillance, and reconnaissance (ISR) applications.
INDUSTRY-LEADING SIZE, WEIGHT, AND POWER (SWAP) CONSUMPTION
The QCS8550 is fabricated on the advanced 4nm node
- 40.27 x 33.41 mm
- 6 W maximum and 2.5 W typical power consumption
- 5 grams (without shields)
- 4nm fabrication node enables low power
and simplifies thermal management
FUTURE PROOF YOUR DESIGN
Utilize the highest-performance SoC in the industry
- 48 TOPS INT 8 AI processor
- 3.2 TOPS on GPU (float 32)
- 8 CPU cores
- 6 MIPI camera interface (5 concurrent)
- USB camera interface
DESIGNED FOR INTEGRATORS
Simplify development and reduce risk with Prism software and support
- OS - Linux LE (r76)
- Development support by qualified engineers
- Sample applications included
- Ongoing model development using realworld and proven synthetic data
Specifications
Hardware
- Memory
- 16GB LPDDR5x
- Operating Environment (OE)
- Input Voltage: 3.6V Operating Temperature: -20 to +60 °C
- Operating System (OS)
- OS - Linux LE (r76)
- Part Number
- Qualcomm 8550 SOM
- Processor
- Qualcomm QCS8550
64-bit Octa-Core
Application processor at 3.2 GHz (Gold+), 2.8GHz (4 x Gold), 2.0GHz (3 x Silver) Qualcomm Kryo CPU
Qualcomm Adreno GPU 740
Qualcomm Hexagon Tensor Processor (HTP) with Hexagon Vector eXtensions (HVX) and Hexagon Matrix eXtensions (HMX)
Qualcomm Secure Processing Unit for advanced secure use cases
Low Power AI (LPAI) subsystem with dedicated DSP and AI accelerator (eNPU) supporting always-on audio, sensors, contextual data streams, and Always-on camera.
- Video
- UHD video processing unit
AV1 decode
Native decode support for H.265 Main 10, H.265 Main, H.264 High, and VP9 profile 2
Native encode support for H.265 Main 10, H.265 Main, H.264 high formats
Mechanical
- Dimensions
- SOM Board: 40.27 x 33.41 mm LGA form factor
- Weight
- 5 grams (without shield)
Storage
- Storage
- 256GB UFS 3.1
Resources & Support
News articles and white papers written by Teledyne FLIR OEM experts to help you integrate your Teledyne FLIR OEM products.
For technical questions, find answers by visiting our FAQ at: flir.custhelp.com
Whitepaper
AI Detection, Target Tracking, and Computational Imaging on Embedded Processors
Learn moreAssets below are shared by all models in this product family.
FLIR AVP - Datasheet
Integrating Teledyne FLIR OEM thermal camera modules is easier than ever with our library of how-to videos and more!
Visit the Support Center for help with your Teledyne FLIR OEM products or submit a support ticket, by visiting our Technical Support Center.
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