The FLIR Lepton® Thermal Camera Breakout Board is an easy-to-interface evaluation board to quickly connect the FLIR Lepton camera module to common platforms like RaspberryPi* or custom hardware. It provides onboard power supplies, generated from 3 – 5.5V, and a master clock. Local power supplies, the master clock, and the power-up sequence components can all be bypassed using a jumper.
Lepton sold separately.
*Raspberry Pi is a trademark of the Raspberry Pi Foundation. This product is not designed or qualified for production use.
Lepton sold separately.
*Raspberry Pi is a trademark of the Raspberry Pi Foundation. This product is not designed or qualified for production use.
Size, Weight and Power (SWAP)
Operating temperature 0°C to 55°C, input voltage: 3 V to 5.5 V, space-saving, (29.5 mm × 29.0 mm), works with all FLIR Lepton modules
Ease of Integration
Faster time to market.
Applications
Designed for applications where SWaP, cost, and quality are critical.
- ECCN Code
- EAR99
Resources & Support
Assets below are shared by all models in this product family.
Integrating Teledyne FLIR OEM thermal camera modules is easier than ever with our library of how-to videos and more!
Visit the Support Center for help with your Teledyne FLIR OEM products or submit a support ticket, by visiting our Technical Support Center.
Boson+
High Performance, Uncooled, LWIR OEM Thermal Camera Module
- 320 × 256 or 640 × 512 Resolution
- ≤20 mK Thermal Sensitivity [NEdT]
- 4° to 95° HFoV
Hadron 640
High Performance, Dual Thermal and Visible OEM Camera Module
- 640 x 512 Thermal Resolution
- 64 MP Visible Camera
- Radiometry Available
Hadron 640 Development Kits
Development Kits for Hadron 640 Dual Camera Module
- Dual Thermal and Visible Camera
- Compatible with Qualcomm® or NVIDIA®
- AI-Ready