Teledyne FLIR continuously enhances the online Lepton integration toolbox to reduce development costs and shorten market time. Application notes, integration videos, quick start guides, and complementary source code for testing on Windows, Linux, Raspberry Pi, and BeagleBone ensure efficient integration. For advanced, large-volume programs, the Technical Services team can support licensing MyFLIR®application software and image enhancing MSX®and Vivid-IR™.
Lepton’s low-power consumption, unmatched image quality, and integration support enable innovative product development in mobile, small electronics, and unattended sensors for smart buildings, fire detection, occupancy tracking, equipment condition monitoring, and more.
ENHANCED THERMAL PERFORMANCE
Greater resolution and sensitivity than common thermopile arrays.
AFFORDABLE MICRO THERMAL CAMERA WITH UNBEATABLE SWAP
Size, power, and lens options enable mobile devices, unattended sensors, and small electronics.
BUILT FOR PROFESSIONAL, LARGE-VOLUME INTEGRATORS
Develop with the industry's leading thermal camera manufacturer to reduce risk, cost, and time to market.
Specifications
Performance
- Scene Temperature Range
- High Gain Mode: -10 °C to 140 °C (14 °F to 284 °F)
Low Gain Mode: -10 °C to +450 °C (14 °F to 842 °F)
- Thermal Spectral Range
- Longwave infrared, 8 µm to 14 µm
Radiometry
- Temperature Accuracy
- High gain: Greater of +/- 5°C or 5% (typical) Low gain: Greater of +/- 10°C or 10% (typical)
- Temperature Measurement
- Yes
Imaging & Optical
- Focal Length
- 1.46 mm
- FOV - Diagonal
- 63.5°
- FOV - Horizontal
- 50° (nominal)
- Frame Rate
- 8.6 Hz (commercial application exportable)
- Frame Rate Options
- 8.6 Hz (commercial application exportable)
- IFOV (mrad)
- 11.64
- Image Optimization
- Factory configured and fully automated
- Non-Uniformity Correction (NUC)
- Integrated Shutter
- Pixel Pitch
- 17 µm
- Pixel Size
- 17 µm
- Resolution
- 80 × 60
- Sensitivity [NEdT]
- <50 mK (0.050° C)
- Spectral Band
- Longwave infrared, 8 µm to 14 µm
- Thermal Imager
- Uncooled microbolometer
- Thermal Imaging Detector
- Uncooled VOx microbolometer
- Video Data Interface
- Video over SPI
Connections & Communications
- Output Format
- User-selectable 14-bit, 8-bit (AGC applied), or 24-bit RGB (AGC and colorization applied)
Electrical
- Control Port
- CCI (I2C-like), CMOS IO Voltage Levels
- Input Clock
- 25-MHz nominal, CMOS IO Voltage Levels
- Input Voltage
- 2.8 V, 1.2 V, 2.5 V to 3.1 V IO
- Power Consumption
- 150 mW (operating), 650 mW (during shutter event), 4 mW (standby)
Mechanical
- Mechanical Interface
- 32–pin socket interface to standard Molex® socket
- Size (L x W x H)
- 12.7 x 11.8 x 7.2 mm
- Weight
- 0.9 grams (without socket)
Environmental & Approvals
- Compliance and Certifications
- NDAA compliant
- Non-Operating Temperature Range
- -40 °C to +80 °C (14 °F to 176 °F)
- Optimum Temperature Range
- -10°C to +80°C (-40 °F to 176 °F)
- Shock
- 1500 G @ 0.4 ms
- Solar protection
- Integrated
- Temperature Compensation
- Automatic. Output image independent of camera temperature.
Export Designations
- ECCN Code
- 6A993.A
Media gallery
Resources & Support
News articles and white papers written by Teledyne FLIR OEM experts to help you integrate your Teledyne FLIR OEM products.
For technical questions, find answers by visiting our FAQ at: flir.custhelp.com
Application Note
Embedded Thermal Condition Monitoring for AI Data Center Infrastructure Using Lepton 3.1R
Learn moreFAQ
Can a FLIR OEM camera data be streamed to disk over the PCI-1422 card and displayed real time?
Read the StoryFAQ
How does a neutral density filter affect the scene dynamic range of FLIR’s OEM cameras?
Read the StoryYou must be logged in to download software or firmware. Please sign in or create an account here.
Lepton SDK and Documentation
Lepton SDK for Windows
Lepton Windows User App V1.3.2
Assets below are shared by all models in this product family.
The Engineering Datasheet provides detailed information.
- Functional Characteristics
- Technical Specifications
- Performance Data
- Electrical and External Circuitry
- Mechanical Recommendations
The mechanical drawings and 3D files are available in IDD+ and STEP formats.
Lepton Camera Breakout Board v2.0 Datasheet
Lepton Engineering Datasheet Rev 400
Lepton FS1 Datasheet
Lepton Series Datasheet
IDD CAD data LEPTON 2.5, 80x60
IDD CAD data LEPTON 3.1R, 160x120
IDD CAD data LEPTON 3.5, 160x120
Lepton 3.1R Dewarping App Note R100
Lepton 80x60 vs Lepton 160x120 App Note
Lepton Breakout Board - Declaration of Compliance Rev 120
Integrating Teledyne FLIR OEM thermal camera modules is easier than ever with our library of how-to videos and more!
Visit the Support Center for help with your Teledyne FLIR OEM products or submit a support ticket, by visiting our Technical Support Center.