Engineered with integrators in mind, the Boson+ IQ Development Kit simplifies integration with three MIPI interfaces for the included Boson+ thermal camera module and additional cameras. The software development kits (SDK), hardware ICD, and comprehensive expert-level engineering support ensure a seamless development experience. The platform is also forward-compatible with future Prism software enhancements, such as Prism SKR and more, making it a future-ready solution for edge AI thermal imaging applications.
EVALUATE AND DEVELOP THERMAL WITH EDGE AI
Access Prism software IR object detectors, advanced ISP, and future additions
- Prism AI real time decision support detection and multi object tracking
- Prism ISP imaging with super-resolution, noise reduction, and more
- Future compatibility with visual navigation and Prism SKR autonomous target detection
- 16-bit real-time recording for offline video pipeline and AI model development
DEVELOP ON THE QUALCOMM DRAGONWING QCS8550 PLATFORM
Premium processor enables extreme edge AI at low power
- Industry-leading 50 TOPS total compute
- Low 2.5 W input power and thermal load running 100% DSP, 60% GPU, and two CPU cores
- 640x512 Boson+ thermal camera module interface
- Three MIPI interfaces for two thermal and one visible camera
DESIGNED FOR INTEGRATORS
Simplify development and reduce risk with software and support
- Boson+ and Prism SDKs
- 640x512 Boson+, MIPI interface board, cable, and carrier board
- User-friendly graphical user interface (GUI)
- Development support by qualified application engineers
Specifications
Imaging & Optical
- Focal Length
- 18 mm
- Frame Size / Rates
- 640 x 512 / 30Hz (typical) to 60Hz (configuration dependent)
1280 x 1024 w/ Super Resolution / 30Hz (typical) to 60Hz (configuration dependent)
- Pixel Pitch
- 12 µm
- Resolution
- Boson+ 640x512 (24° HFOV) w/ shutter
Connections & Communications
- Video Input - Thermal Camera Module
- MIPI 2-lane CSI-2 (D-PHY)
- Video Inputs - Camera 2 and 3
- MIPI 4-lane CSI-2 (D-PHY)
Electrical
- Input Voltage
- 5 - 36 VDC (12 VDC nom)
- Power Consumption
- 2.5 W (100% DSP, 60% GPU load, and two CPU cores)
4 W (typical w/ Boson+)
Mechanical
- Dimensions w/ Enclosure Assembly (w/o Boson+)
- 52 x 41.5 x 50.5 mm
- Weight w/ Enclosure Assembly (w/o Boson+)
- 90 g
Environmental & Approvals
- Compliance and Certifications
- NDAA Compliant
Fabrication Quality Assurance Boards assembled to IPC-A-610 Class 2 specifications by an ISO 9001 and AS 9101 certified facility
ROHS directive 2011/65/EU and 2015/863/EU compliant materials and processes
- Operating Temperature Range
- -40 °C to 60 °C
Export Designations
- ECCN Code
- 6A003.b.4.b (Fast Video, 60Hz)
Resources & Support
News articles and white papers written by Teledyne FLIR OEM experts to help you integrate your Teledyne FLIR OEM products.
For technical questions, find answers by visiting our FAQ at: flir.custhelp.com
Application Note
A Guide on Cost-Effective Thermal Lens Integration: What to Know for Defense and Autonomous Vehicle Applications
Learn more
Whitepaper
How to Use Automated Synthetic Data Generation in AI Model Development for Object Detection
Read the Story
Boson Lens Selector Tool
Enter your target parameters to receive a recommended lens focal length.
Visit the Support Center for help with your Teledyne FLIR OEM products or submit a support ticket, by visiting our Technical Support Center.
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