Boson+, available in two resolutions, multiple lens options, and with radiometry on select lenses, can also be specified with a factory-integrated continuous zoom lens to streamline development, and maximize performance. With customer-selectable USB, CMOS, or MIPI video interfaces, it is easier than ever to integrate Boson+ into a wide range of embedded processors from Qualcomm®, NVIDIA®, Ambarella, and more. The user-friendly SDK, updated GUI, and comprehensive product documentation further simplify OEM integration for unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), wearables, security applications, handhelds, and thermal sights.
Market-leading Thermal Sensitivity, Contrast, and Latency
NEDT of ≤20 mK extends detection, recognition, and identification (DRI) performance
Optimized Size, Weight, and Power (SWaP)
Full-featured LWIR thermal camera module just 7.5 grams and less than 4.9 cm³
Designed for Integrators
Shared mechanical, electrical, and video interface across all Boson models
Specifications
Radiometry
- Temperature Measurement
- No
Imaging & Optical
- Digital Zoom
- 1x to 8x zoom
- f-number
- 1.0
- FOV - Horizontal
- 50°
- Frame Rate
- 60Hz default; 30 Hz runtime selectable
- HFOV
- 50°
- IFOV (mrad)
- 1.30434782608696
- Non-Uniformity Correction (NUC)
- Factory calibrated; updated FFCs with FLIR’s Silent Shutterless NUC (SSN™)
- Pixel Pitch
- 12 µm
- Resolution
- 640 x 512
- Scene Dynamic Range
- Up to 140 °C (high gain)
- Sensitivity [NEdT]
- <20 mK (Industrial); <30 mK (Professional)
- Spectral Band
- Longwave infrared; 8 µm – 14 µm
- Symbol overlay
- Re-writable each frame; alpha blending for translucent overlay
Connections & Communications
- Control Channels
- UART, USB or I2C
- Peripheral Channels
- I2C, SPI, SDIO
- Video Channels
- CMOS, MIPI or USB
Electrical
- Input Voltage
- 3.3 VDC
- Power Consumption
- Varies by configuration; starting at 1000 mW
Mechanical
- Precision Mounting Holes
- Four tapped M1.6x0.35 (rear cover)
- Size (L x W x H)
- 21 x 21 x 11 mm (w/o lens)
- Weight
- 7.5 g without lens (configuration dependent)
Environmental & Approvals
- Compliance and Certifications
- NDAA compliant
ROHS compliant
REACH compliant
- Non-Operating Temperature Range
- -50 °C to 85 °C
- Operating Temperature Range
- -40 °C to 80 °C
- Operational Altitude
- 12 km (max altitude of a commercial airliner or airborne platform)
- Shock
- 1,500 g @ 0.4 msec
- Solar protection
- Yes, when integrated with factory lens
Export Designations
- ECCN Code
- 6A003.b.4.b (Fast Video, 60Hz)
6A993.A (Slow Video, 9Hz)
Resources & Support
News articles and white papers written by Teledyne FLIR OEM experts to help you integrate your Teledyne FLIR OEM products.
For technical questions, find answers by visiting our FAQ at: flir.custhelp.com
Application Note
A Guide on Cost-Effective Thermal Lens Integration: What to Know for Defense and Autonomous Vehicle Applications
Learn moreWhitepaper
AI Detection, Target Tracking, and Computational Imaging on Embedded Processors
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Assets below are shared by all models in this product family.
The Engineering Datasheet provides detailed information.
- Functional Characteristics
- Technical Specifications
- Performance Data
- Electrical and External Circuitry
- Mechanical Recommendations
The mechanical drawings and 3D files are available in IDD+ and STEP formats.
Integrating Teledyne FLIR OEM thermal camera modules is easier than ever with our library of how-to videos and more!
Boson Lens Selector Tool
Enter your target parameters to receive a recommended lens focal length.
Visit the Support Center for help with your Teledyne FLIR OEM products or submit a support ticket, by visiting our Technical Support Center.